PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD28L SPDIP .300inAll Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes2.0875
DSPIC30F3010-30I/SP |
RFQ for DSPIC30F3010-30I/SP |
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| Technical/Catalog Information | DSPIC30F3010-30I/SP |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Program Memory Size | 24KB (24K x 8) |
| RAM Size | 1K x 8 |
| Number of I /O | 20 |
| Package / Case | 28-DIP (300 mil) |
| Speed | 30 MIPs |
| Controller Series | dsPIC30F |
| Oscillator Type | Internal |
| Packaging | Tube |
| Program Memory Type | FLASH |
| EEPROM Size | 1K x 8 |
| Core Processor | dsPIC |
| Data Converters | A/D 6x10b |
| Core Size | 16-Bit |
| Operating Temperature | -40°C ~ 85°C |
| Connectivity | I²C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT |
| Voltage - Supply (Vcc/Vdd) | 2.5 V ~ 5.5 V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | DSPIC30F3010 30I SP DSPIC30F301030ISP DSPIC30F301030ISP ND DSPIC30F301030ISPND DSPIC30F301030ISP |
| Product | Manufacturers | Pack | D/C | ||||||||
| DSPIC30F3010-30I/SP | - | - | - |